XCVC1702-2LSENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 89,908.99 AED | Dhs. 89,908.99 AED |
| 15+ | Dhs. 87,069.76 AED | Dhs. 1,306,046.40 AED |
| 25+ | Dhs. 85,176.94 AED | Dhs. 2,129,423.50 AED |
| 50+ | Dhs. 80,444.88 AED | Dhs. 4,022,244.00 AED |
| 100+ | Dhs. 70,980.78 AED | Dhs. 7,098,078.00 AED |
| N+ | Dhs. 14,196.16 AED | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1702-2LSENSVG1369
The AMD XCVC1702-2LSENSVG1369 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing cores to deliver unparalleled flexibility for AI, edge computing, aerospace, automotive, and industrial applications.
Key Features & Benefits
- Massive Logic Capacity: 1 million logic cells provide extensive programmable resources for complex designs
- Dual Processing Architecture: Integrated dual ARM® Cortex®-A72 MPCore™ (1.08GHz) and dual ARM® Cortex™-R5F (450MHz) processors with CoreSight™ debug
- Rich Connectivity: Comprehensive I/O including PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART, and MMC/SD/SDIO interfaces
- Industrial-Grade Reliability: Operating temperature range of 0°C to 100°C (TJ) ensures robust performance in demanding environments
- Advanced Packaging: 1369-pin FCBGA (35x35mm) package optimized for high-density designs
- DMA & Memory Support: High-speed data movement with integrated DMA controllers and DDR memory interfaces
Ideal Applications
This Versal AI Core device excels in edge AI inference, 5G wireless infrastructure, automotive ADAS systems, industrial automation, aerospace avionics, medical imaging, and high-performance embedded computing platforms requiring adaptive hardware acceleration.
Manufacturer: AMD | Part Number: XCVC1702-2LSENSVG1369
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |

XCVC1702-2LSENSVG1369.pdf