AMD XCVC1802-1LLIVSVA2197

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AMD Versal™ AI Core XCVC1802-1LLIVSVA2197 FPGA

High-performance adaptive computing platform featuring 1.5 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Designed for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.

Key Features

  • 1.5M Logic Cells - Extensive programmable logic resources for complex designs
  • Dual-Core Processing - ARM Cortex-A72 MPCore (1GHz) + ARM Cortex-R5F (400MHz) with CoreSight debug
  • 256KB On-Chip RAM - High-speed embedded memory
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO
  • Advanced Peripherals - DDR memory controller, DMA, PCIe interface
  • Compact 2197-FCBGA Package - 45mm x 45mm footprint for space-constrained designs

Applications

Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, video processing, and high-performance embedded computing platforms requiring adaptive hardware acceleration.

Documentation: Full datasheets, reference designs, and technical documentation available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)