XCVC1802-1LLIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 137,196.84 AED | Dhs. 137,196.84 AED |
| 15+ | Dhs. 132,864.28 AED | Dhs. 1,992,964.20 AED |
| 25+ | Dhs. 129,975.93 AED | Dhs. 3,249,398.25 AED |
| 50+ | Dhs. 122,755.05 AED | Dhs. 6,137,752.50 AED |
| 100+ | Dhs. 108,313.28 AED | Dhs. 10,831,328.00 AED |
| N+ | Dhs. 21,662.66 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1802-1LLIVSVA2197 FPGA
High-performance adaptive computing platform featuring 1.5 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Designed for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.
Key Features
- 1.5M Logic Cells - Extensive programmable logic resources for complex designs
- Dual-Core Processing - ARM Cortex-A72 MPCore (1GHz) + ARM Cortex-R5F (400MHz) with CoreSight debug
- 256KB On-Chip RAM - High-speed embedded memory
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO
- Advanced Peripherals - DDR memory controller, DMA, PCIe interface
- Compact 2197-FCBGA Package - 45mm x 45mm footprint for space-constrained designs
Applications
Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, video processing, and high-performance embedded computing platforms requiring adaptive hardware acceleration.
Documentation: Full datasheets, reference designs, and technical documentation available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1802-1LLIVSVA2197.pdf