AMD XCVC1802-1LLIVSVD1760

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AMD Versal™ AI Core XCVC1802-1LLIVSVD1760 FPGA

High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. The XCVC1802 delivers 1.5M logic cells in a 1760-FCBGA package, engineered for demanding industrial, automotive, aerospace, and communications applications.

Key Features

  • Processing Power: Dual ARM® Cortex®-A72 MPCore™ (1GHz) + Dual ARM® Cortex™-R5F (400MHz) with CoreSight™
  • Logic Capacity: 1.5 million logic cells for complex FPGA designs
  • Memory: 256KB integrated RAM
  • Connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Grade: Extended temperature range -40°C to +100°C (TJ)
  • Package: 1760-FCBGA (40mm × 40mm) for high-density integration

Applications

Ideal for AI/ML inference acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, high-performance embedded computing, and edge AI deployments requiring adaptive compute with deterministic real-time processing.

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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)