-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVC1802-1LSEVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 91,463.07 AED | Dhs. 91,463.07 AED |
| 15+ | Dhs. 88,574.76 AED | Dhs. 1,328,621.40 AED |
| 25+ | Dhs. 86,649.22 AED | Dhs. 2,166,230.50 AED |
| 50+ | Dhs. 81,835.37 AED | Dhs. 4,091,768.50 AED |
| 100+ | Dhs. 72,207.68 AED | Dhs. 7,220,768.00 AED |
| N+ | Dhs. 14,441.54 AED | Price Inquiry |
Couldn't load pickup availability
AMD Versal AI Core FPGA XCVC1802-1LSEVSVA2197
The AMD XCVC1802-1LSEVSVA2197 is a high-performance Versal AI Core FPGA designed for demanding applications in industrial automation, automotive systems, aerospace, communications infrastructure, and edge AI/ML computing. This advanced System-on-Chip (SoC) combines adaptive FPGA fabric with embedded processing engines to deliver exceptional performance and flexibility.
Key Features & Benefits
- 1.5 Million Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore running at 1GHz - High-performance application processing with CoreSight debug
- Dual ARM Cortex-R5F at 400MHz - Real-time processing for safety-critical and deterministic workloads
- 256KB On-Chip RAM - Fast local memory for data-intensive operations
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (junction temperature)
- 2197-FCBGA Package (45x45mm) - High-density ball grid array for space-constrained designs
Ideal Applications
This Versal AI Core device excels in edge AI inference, vision processing, software-defined networking, 5G wireless infrastructure, ADAS automotive systems, industrial robotics, and high-speed data acquisition platforms where adaptive compute acceleration is essential.
Authentic AMD product with full manufacturer traceability and documentation support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
XCVC1802-1LSEVSVA2197.pdf