• XCVC1802-1LSEVSVD1760 AMD AMD IC SOC VERSAL AICORE FPGA 1760BGA Original Authentic IC Component
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AMD

XCVC1802-1LSEVSVD1760

Dhs. 88,083.36
Dhs. 92,719.33 Dhs. 88,083.36
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Recycling Electronic Components

AMD Versal™ AI Core FPGA - XCVC1802-1LSEVSVD1760

High-performance System-on-Chip (SoC) FPGA solution combining adaptive compute acceleration with embedded processing for industrial, automotive, aerospace, communications, and edge computing applications.

Key Features:

  • 1.5 Million Logic Cells - Massive FPGA fabric for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ debug
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™
  • 256KB On-Chip RAM for high-speed data processing
  • Advanced Connectivity: PCIe, Ethernet, CANbus, USB OTG, DDR, SPI, I2C, UART
  • Industrial Temperature Range: 0°C to 100°C (TJ)
  • Compact 1760-FCBGA Package (40mm x 40mm)

Applications:

Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, edge computing platforms, and high-performance embedded vision systems.

Authenticity Guaranteed: All AMD Versal devices are sourced from authorized distributors with full traceability and manufacturer warranty support.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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