AMD XCVC1802-1LSEVSVD1760
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Dhs. 88,086.48
Regular price
Dhs. 92,722.61
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Dhs. 88,086.48
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| 1 | Dhs. 88,086.48 | Dhs. 88,086.48 |
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| N+ | Dhs. 13,908.39 | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1802-1LSEVSVD1760
High-performance System-on-Chip (SoC) FPGA solution combining adaptive compute acceleration with embedded processing for industrial, automotive, aerospace, communications, and edge computing applications.
Key Features:
- 1.5 Million Logic Cells - Massive FPGA fabric for complex designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ debug
- Dual ARM® Cortex™-R5F real-time processors with CoreSight™
- 256KB On-Chip RAM for high-speed data processing
- Advanced Connectivity: PCIe, Ethernet, CANbus, USB OTG, DDR, SPI, I2C, UART
- Industrial Temperature Range: 0°C to 100°C (TJ)
- Compact 1760-FCBGA Package (40mm x 40mm)
Applications:
Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, edge computing platforms, and high-performance embedded vision systems.
Authenticity Guaranteed: All AMD Versal devices are sourced from authorized distributors with full traceability and manufacturer warranty support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
XCVC1802-1LSEVSVD1760.pdf
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