XCVC1802-1LSIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 114,347.13 AED | Dhs. 114,347.13 AED |
| 15+ | Dhs. 110,736.15 AED | Dhs. 1,661,042.25 AED |
| 25+ | Dhs. 108,328.84 AED | Dhs. 2,708,221.00 AED |
| 50+ | Dhs. 102,310.57 AED | Dhs. 5,115,528.50 AED |
| 100+ | Dhs. 90,274.04 AED | Dhs. 9,027,404.00 AED |
| N+ | Dhs. 18,054.81 AED | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1802-1LSIVSVA2197
High-performance adaptive compute acceleration platform (ACAP) combining scalar processing engines, adaptable hardware engines, and intelligent AI engines with leading-edge memory and interfacing technologies. Engineered for mission-critical aerospace, automotive ADAS, industrial automation, 5G wireless infrastructure, and high-performance embedded computing applications requiring advanced processing capabilities with deterministic real-time control.
Key Features & Capabilities
- 1.5M Logic Cells - Extensive programmable logic resources for complex, high-density FPGA designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1GHz for application processing
- Dual ARM® Cortex™-R5F with CoreSight™ at 400MHz for deterministic real-time processing and control
- 256KB Integrated RAM - On-chip memory for low-latency data access
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments and mission-critical deployments
- Rich Connectivity Options: PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
- High-Speed Peripherals: DDR4 memory controller, DMA engines, PCIe for maximum data throughput
- AI Engine Array - Hardware-accelerated AI/ML inference and DSP processing
- 2197-FCBGA Package - 45x45mm fine-pitch ball grid array for high-density integration
Target Applications
Ideal for AI/ML acceleration and inference, 5G wireless infrastructure and O-RAN, automotive ADAS and autonomous driving systems, aerospace and defense avionics, industrial automation and robotics controllers, high-performance embedded vision systems, software-defined radio (SDR), and edge computing platforms requiring adaptive processing with deterministic real-time control and functional safety.
Package & Reliability
Package: 2197-FCBGA (45x45mm) fine-pitch ball grid array for high-density board integration with excellent thermal performance and signal integrity. RoHS compliant.
Documentation & Support
Backed by AMD's long-term product availability commitment and comprehensive technical documentation including datasheets, reference designs, IP cores, and development tools for reliable, production-ready design-in. Full traceability and authenticity guaranteed.
Why Choose This FPGA?
The Versal AI Core XCVC1802 delivers unmatched adaptive computing performance for next-generation systems requiring AI acceleration, real-time processing, and flexible I/O connectivity in a single device. Proven reliability for industrial and mission-critical applications with extended temperature operation and long-term availability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1802-1LSIVSVA2197.pdf