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XCVC1802-1LSIVSVA2197

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AMD Versal™ AI Core FPGA - XCVC1802-1LSIVSVA2197

High-performance adaptive compute acceleration platform (ACAP) combining scalar processing engines, adaptable hardware engines, and intelligent AI engines with leading-edge memory and interfacing technologies. Engineered for mission-critical aerospace, automotive ADAS, industrial automation, 5G wireless infrastructure, and high-performance embedded computing applications requiring advanced processing capabilities with deterministic real-time control.

Key Features & Capabilities

  • 1.5M Logic Cells - Extensive programmable logic resources for complex, high-density FPGA designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1GHz for application processing
  • Dual ARM® Cortex™-R5F with CoreSight™ at 400MHz for deterministic real-time processing and control
  • 256KB Integrated RAM - On-chip memory for low-latency data access
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments and mission-critical deployments
  • Rich Connectivity Options: PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • High-Speed Peripherals: DDR4 memory controller, DMA engines, PCIe for maximum data throughput
  • AI Engine Array - Hardware-accelerated AI/ML inference and DSP processing
  • 2197-FCBGA Package - 45x45mm fine-pitch ball grid array for high-density integration

Target Applications

Ideal for AI/ML acceleration and inference, 5G wireless infrastructure and O-RAN, automotive ADAS and autonomous driving systems, aerospace and defense avionics, industrial automation and robotics controllers, high-performance embedded vision systems, software-defined radio (SDR), and edge computing platforms requiring adaptive processing with deterministic real-time control and functional safety.

Package & Reliability

Package: 2197-FCBGA (45x45mm) fine-pitch ball grid array for high-density board integration with excellent thermal performance and signal integrity. RoHS compliant.

Documentation & Support

Backed by AMD's long-term product availability commitment and comprehensive technical documentation including datasheets, reference designs, IP cores, and development tools for reliable, production-ready design-in. Full traceability and authenticity guaranteed.

Why Choose This FPGA?

The Versal AI Core XCVC1802 delivers unmatched adaptive computing performance for next-generation systems requiring AI acceleration, real-time processing, and flexible I/O connectivity in a single device. Proven reliability for industrial and mission-critical applications with extended temperature operation and long-term availability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

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