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XCVC1802-1MLIVSVA2197

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AMD Versal™ AI Core XCVC1802-1MLIVSVA2197 FPGA System-on-Chip

The AMD Versal AI Core XCVC1802-1MLIVSVA2197 represents cutting-edge FPGA technology, delivering exceptional processing power and versatility for demanding industrial, automotive, aerospace, communications, and edge computing applications. This high-performance System-on-Chip combines 1.5 million logic cells with dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F cores, providing unparalleled computational capabilities for complex embedded systems.

Key Features & Benefits

  • Massive Logic Capacity: 1.5M logic cells enable implementation of sophisticated algorithms and complex digital designs
  • Heterogeneous Processing: Dual ARM Cortex-A72 MPCore (1.3GHz) + Dual ARM Cortex-R5F (600MHz) for optimal workload distribution
  • Rich Connectivity: Integrated PCIe, DDR, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART, and MMC/SD/SDIO interfaces
  • Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C TJ) for harsh environments
  • Advanced Packaging: 2197-FCBGA (45x45mm) for high-density integration and thermal performance
  • Flexible Memory Architecture: 256KB on-chip RAM with DDR controller support for external memory expansion

Ideal Applications

This Versal AI Core FPGA is engineered for mission-critical applications requiring high computational throughput, real-time processing, and adaptive intelligence including autonomous systems, 5G/6G infrastructure, industrial automation, aerospace avionics, medical imaging, and AI/ML acceleration at the edge.

Why Choose This FPGA?

Backed by AMD's proven track record in high-performance computing, the XCVC1802-1MLIVSVA2197 delivers enterprise-grade reliability, comprehensive development tool support, and long product lifecycle commitment. Authentic components sourced directly from authorized channels ensure quality, traceability, and full manufacturer warranty coverage.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

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