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XCVC1802-1MLIVSVD1760

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AMD Versal™ AI Core XCVC1802-1MLIVSVD1760 FPGA System-on-Chip

The XCVC1802-1MLIVSVD1760 represents the pinnacle of adaptive computing technology from AMD's Versal™ AI Core series. This high-performance System-on-Chip (SoC) seamlessly integrates adaptive FPGA fabric with powerful embedded ARM processors, delivering unmatched flexibility and performance for mission-critical applications in industrial automation, automotive systems, aerospace, telecommunications, and AI-accelerated edge computing.

Core Performance Features

  • 1.5 Million Logic Cells - Massive programmable logic capacity enabling complex, multi-function designs with room for future expansion
  • Dual ARM® Cortex®-A72 MPCore™ Processors - High-performance 1.3GHz application processors with integrated CoreSight™ debug and trace capabilities for sophisticated software workloads
  • Dual ARM® Cortex™-R5F Real-Time Processors - Dedicated 600MHz real-time cores with CoreSight™ for deterministic control and safety-critical functions
  • 256KB High-Speed On-Chip RAM - Ultra-low latency memory for time-critical data processing and buffering
  • Industrial Temperature Range: -40°C to 100°C (TJ) - Engineered for reliable operation in harsh environmental conditions including automotive, industrial, and outdoor deployments
  • Comprehensive Connectivity Suite - PCIe Gen4, Multi-Gigabit Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces for seamless system integration
  • Advanced System Peripherals - Integrated DDR memory controller, multi-channel DMA engines, and PCIe interface for high-bandwidth data movement
  • Compact 1760-FCBGA Package - Space-efficient 40mm x 40mm footprint with excellent thermal characteristics

Target Applications & Use Cases

  • Industrial Automation - Programmable logic controllers (PLCs), machine vision systems, robotics control, and real-time process monitoring
  • Automotive ADAS & Autonomous Driving - Sensor fusion, object detection and classification, path planning, and safety-critical decision-making systems
  • Aerospace & Defense - Avionics systems, radar signal processing, secure communications, and mission-critical embedded computing
  • 5G/6G Wireless Infrastructure - Baseband processing, beamforming, massive MIMO, and software-defined radio (SDR) implementations
  • AI/ML Edge Computing - Real-time inference acceleration, neural network deployment, computer vision, and intelligent edge analytics
  • High-Performance Data Acquisition - Multi-channel data capture, real-time signal processing, and high-speed data streaming applications

Why Choose AMD Versal AI Core XCVC1802?

AMD Versal AI Core devices represent a paradigm shift in adaptive computing, delivering unprecedented flexibility and performance for next-generation embedded systems. The heterogeneous architecture combines programmable FPGA fabric, high-performance scalar processing engines, and dedicated AI acceleration engines, enabling you to:

  • Accelerate Critical Workloads - Offload compute-intensive tasks to optimized hardware accelerators while maintaining software flexibility
  • Reduce System Latency - Process data at the edge with minimal delay, critical for real-time control and safety systems
  • Adapt to Evolving Standards - Update FPGA logic and software without costly hardware redesigns as protocols and requirements change
  • Consolidate System Functions - Integrate multiple discrete components into a single, power-efficient SoC, reducing BOM costs and board complexity
  • Future-Proof Your Design - Leverage the adaptability of FPGA technology to extend product lifecycles and support new features via firmware updates

Quality & Authenticity Guarantee

100% Authentic AMD Product - Every XCVC1802-1MLIVSVD1760 device is sourced directly from authorized AMD distribution channels, ensuring full manufacturer traceability, warranty support, and access to comprehensive technical documentation including datasheets, reference designs, and development tools.

Backed by AMD's industry-leading support ecosystem and extensive documentation resources for rapid development and deployment.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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