XCVC1802-1MSEVSVA2197

AMD XCVC1802-1MSEVSVA2197 Versal™ AI Core FPGA

High-performance system-on-chip (SoC) FPGA combining adaptive computing with embedded processing for AI, automotive, aerospace, and industrial applications. Features 1.5 million logic cells, dual ARM® Cortex®-A72 and Cortex®-R5F processors, comprehensive connectivity, and industrial-grade reliability.

Key Features

• 1.5M Logic Cells – Versal AI Core architecture for adaptive compute acceleration
• Dual ARM Cortex-A72 MPCore (1.3GHz) – High-performance application processing with CoreSight debug
• Dual ARM Cortex-R5F (600MHz) – Real-time processing for safety-critical workloads
• 256KB On-Chip RAM – Low-latency memory for embedded applications
• Rich Connectivity – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I²C, UART, MMC/SD/SDIO
• Industrial Temperature Range – 0°C to 100°C junction temperature for harsh environments
• 2197-FCBGA Package – 45mm × 45mm fine-pitch ball grid array for high I/O density

Applications

Ideal for edge AI inference, automotive ADAS/autonomous driving, 5G wireless infrastructure, aerospace/defense systems, industrial automation, medical imaging, and high-performance embedded computing requiring heterogeneous processing and FPGA fabric.

Documentation: Full datasheets, reference manuals, and design resources available from AMD.

• XCVC1802-1MSEVSVA2197.pdf