AMD XCVC1802-1MSEVSVA2197
Regular price
Dhs. 76,230.39
Regular price
Dhs. 80,242.52
Sale price
Dhs. 76,230.39
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 76,230.39 | Dhs. 76,230.39 |
| 15+ | Dhs. 73,823.12 | Dhs. 1,107,346.80 |
| 25+ | Dhs. 72,218.27 | Dhs. 1,805,456.75 |
| 50+ | Dhs. 68,206.14 | Dhs. 3,410,307.00 |
| 100+ | Dhs. 60,181.89 | Dhs. 6,018,189.00 |
| N+ | Dhs. 12,036.38 | Price Inquiry |
Shipping calculated at checkout.
Request Quote / Inquiry
AMD XCVC1802-1MSEVSVA2197 Versal™ AI Core FPGA
High-performance system-on-chip (SoC) FPGA combining adaptive computing with embedded processing for AI, automotive, aerospace, and industrial applications. Features 1.5 million logic cells, dual ARM® Cortex®-A72 and Cortex®-R5F processors, comprehensive connectivity, and industrial-grade reliability.
Key Features
- 1.5M Logic Cells – Versal AI Core architecture for adaptive compute acceleration
- Dual ARM Cortex-A72 MPCore (1.3GHz) – High-performance application processing with CoreSight debug
- Dual ARM Cortex-R5F (600MHz) – Real-time processing for safety-critical workloads
- 256KB On-Chip RAM – Low-latency memory for embedded applications
- Rich Connectivity – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I²C, UART, MMC/SD/SDIO
- Industrial Temperature Range – 0°C to 100°C junction temperature for harsh environments
- 2197-FCBGA Package – 45mm × 45mm fine-pitch ball grid array for high I/O density
Applications
Ideal for edge AI inference, automotive ADAS/autonomous driving, 5G wireless infrastructure, aerospace/defense systems, industrial automation, medical imaging, and high-performance embedded computing requiring heterogeneous processing and FPGA fabric.
Documentation: Full datasheets, reference manuals, and design resources available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
XCVC1802-1MSEVSVA2197.pdf
×