• XCVC1802-1MSEVSVD1760 AMD AMD IC SOC VERSAL AICORE FPGA 1760BGA Original Authentic IC Component
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AMD

XCVC1802-1MSEVSVD1760

Dhs. 73,398.21
Dhs. 77,261.27 Dhs. 73,398.21
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Recycling Electronic Components

AMD XCVC1802-1MSEVSVD1760 Versal™ AI Core FPGA

The AMD XCVC1802-1MSEVSVD1760 is a high-performance Versal™ AI Core FPGA featuring 1.5 million logic cells, designed for demanding industrial, automotive, aerospace, and communications applications. This advanced system-on-chip combines adaptive computing with embedded processing power.

Key Features

  • 1.5M Logic Cells - Extensive programmable logic resources for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ - High-performance 1.3GHz application processors with CoreSight™
  • Dual ARM® Cortex™-R5F - Real-time 600MHz processors with CoreSight™ for deterministic control
  • 256KB On-Chip RAM - Fast embedded memory for data buffering and processing
  • Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
  • 1760-FCBGA Package - Compact 40x40mm flip-chip ball grid array for high-density designs

Applications

Ideal for edge AI inference, 5G wireless infrastructure, automotive ADAS systems, industrial automation, aerospace avionics, high-speed networking equipment, and embedded vision processing.

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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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