AMD XCVC1802-2HSIVSVA2197

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AMD Versal AI Core FPGA - XCVC1802-2HSIVSVA2197

High-performance Versal AI Core FPGA featuring 1.5M logic cells with dual ARM Cortex-A72 MPCore and Cortex-R5F processors. Designed for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and reliability.

Key Features:

  • 1.5M Logic Cells for complex FPGA designs
  • Dual ARM Cortex-A72 MPCore with CoreSight (1.65GHz)
  • Dual ARM Cortex-R5F with CoreSight (800MHz)
  • 256KB RAM with DDR, DMA, PCIe peripherals
  • Comprehensive connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART
  • Industrial temperature range: -40°C to 100°C (TJ)
  • 2197-FCBGA package (45x45mm)
Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)