XCVC1802-2HSIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 137,619.42 AED | Dhs. 137,619.42 AED |
| 15+ | Dhs. 133,273.54 AED | Dhs. 1,999,103.10 AED |
| 25+ | Dhs. 130,376.29 AED | Dhs. 3,259,407.25 AED |
| 50+ | Dhs. 123,133.16 AED | Dhs. 6,156,658.00 AED |
| 100+ | Dhs. 108,646.91 AED | Dhs. 10,864,691.00 AED |
| N+ | Dhs. 21,729.38 AED | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1802-2HSIVSVD1760
The AMD XCVC1802-2HSIVSVD1760 is a high-performance Versal AI Core FPGA featuring 1.5 million logic cells, designed for demanding applications in industrial automation, automotive systems, aerospace, communications infrastructure, and edge computing deployments.
Key Features
- Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1.65GHz
- Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 800MHz
- 1.5M Logic Cells for complex FPGA fabric implementations
- 256KB RAM for embedded processing
- Industrial Temperature Range: -40°C to 100°C (TJ)
- Advanced Connectivity: PCIe, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART
- Compact 1760-FCBGA Package (40x40mm)
Applications
Ideal for high-performance embedded systems requiring adaptive compute acceleration, AI/ML inference at the edge, real-time signal processing, and heterogeneous multiprocessing architectures. Perfect for industrial control systems, automotive ADAS, 5G infrastructure, aerospace avionics, and advanced robotics.
Documentation: Full technical specifications and design resources available in the AMD Versal AI Core datasheet.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |

XCVC1802-2HSIVSVD1760.pdf