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XCVC1802-2HSIVSVD1760

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AMD Versal™ AI Core FPGA - XCVC1802-2HSIVSVD1760

The AMD XCVC1802-2HSIVSVD1760 is a high-performance Versal AI Core FPGA featuring 1.5 million logic cells, designed for demanding applications in industrial automation, automotive systems, aerospace, communications infrastructure, and edge computing deployments.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1.65GHz
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 800MHz
  • 1.5M Logic Cells for complex FPGA fabric implementations
  • 256KB RAM for embedded processing
  • Industrial Temperature Range: -40°C to 100°C (TJ)
  • Advanced Connectivity: PCIe, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART
  • Compact 1760-FCBGA Package (40x40mm)

Applications

Ideal for high-performance embedded systems requiring adaptive compute acceleration, AI/ML inference at the edge, real-time signal processing, and heterogeneous multiprocessing architectures. Perfect for industrial control systems, automotive ADAS, 5G infrastructure, aerospace avionics, and advanced robotics.

Documentation: Full technical specifications and design resources available in the AMD Versal AI Core datasheet.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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