AMD XCVC1802-2LLIVSVA2197

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AMD Versal™ AI Core XCVC1802-2LLIVSVA2197 FPGA

The XCVC1802-2LLIVSVA2197 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ AI Core series, designed for demanding applications in aerospace, automotive, industrial automation, telecommunications, and medical systems.

Key Features

  • 1.5M Logic Cells - Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1.08GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 450MHz
  • 256KB RAM - Integrated memory for efficient data handling
  • Advanced Connectivity - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • 2197-FCBGA Package - 45x45mm fine-pitch ball grid array for high-density integration
  • RoHS Compliant - Environmentally friendly manufacturing

Applications

Ideal for AI/ML acceleration, edge computing, 5G infrastructure, advanced driver assistance systems (ADAS), industrial automation, medical imaging, and high-performance embedded systems requiring adaptive compute capabilities.

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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.