XCVC1802-2LSEVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 114,339.34 AED | Dhs. 114,339.34 AED |
| 15+ | Dhs. 110,728.61 AED | Dhs. 1,660,929.15 AED |
| 25+ | Dhs. 108,321.46 AED | Dhs. 2,708,036.50 AED |
| 50+ | Dhs. 102,303.60 AED | Dhs. 5,115,180.00 AED |
| 100+ | Dhs. 90,267.89 AED | Dhs. 9,026,789.00 AED |
| N+ | Dhs. 18,053.58 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1802-2LSEVSVA2197 FPGA System-on-Chip
The AMD Versal AI Core XCVC1802-2LSEVSVA2197 is a high-performance FPGA System-on-Chip engineered for mission-critical industrial, automotive, aerospace, communications, and edge computing applications. This advanced heterogeneous computing platform combines adaptive FPGA fabric with embedded ARM processing cores, delivering exceptional performance, flexibility, and power efficiency for next-generation intelligent systems and AI-accelerated workloads.
Key Features & Capabilities
- 1.5 Million Logic Cells - Massive programmable fabric enabling complex, high-density designs with extensive parallel processing capability
- Dual ARM® Cortex®-A72 MPCore™ - High-performance 64-bit application processing at 1.08GHz with CoreSight™ debug and trace
- Dual ARM® Cortex™-R5F - Deterministic real-time processing at 450MHz with CoreSight™ for safety-critical control loops
- 256KB On-Chip RAM - Fast, low-latency embedded memory for critical operations and data buffering
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ) for harsh environment deployment
- Rich Connectivity Ecosystem - PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, DDR4/LPDDR4, Quad SPI, I2C, UART, MMC/SD/SDIO interfaces
- Compact 2197-FCBGA Package - Space-efficient 45x45mm form factor optimized for high-density board designs
- Advanced Security Features - Hardware root of trust, secure boot, encryption engines, and tamper detection
Target Applications & Use Cases
- Aerospace & Defense Systems - Radar processing, avionics, secure communications, signal intelligence
- Automotive ADAS & Autonomous Driving - Sensor fusion, real-time object detection, path planning, V2X communication
- Industrial Automation & Control - Motion control, machine vision, predictive maintenance, robotics
- 5G/6G Communications Infrastructure - Baseband processing, beamforming, network slicing, edge MEC
- Edge AI & Machine Learning - Neural network inference acceleration, computer vision, anomaly detection
- High-Performance Embedded Computing - Software-defined systems, data acquisition, real-time analytics
Why Choose AMD Versal AI Core?
The Versal AI Core architecture delivers unmatched adaptability for evolving system requirements. With its heterogeneous processing subsystem combining scalar processors, adaptable engines, and intelligent engines, you can optimize performance-per-watt while maintaining design flexibility. The platform supports industry-standard development tools and frameworks, accelerating time-to-market for complex embedded systems.
Authenticity & Quality Assurance: All AMD Versal devices are sourced directly from authorized distributors with full supply chain traceability, manufacturer warranty support, and compliance documentation. Complete technical documentation, reference designs, and development resources available to support your design cycle.
Technical Support: Access to AMD's comprehensive ecosystem including Vivado Design Suite, Vitis Unified Software Platform, PetaLinux tools, and extensive IP library for rapid prototyping and production deployment.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1802-2LSEVSVA2197.pdf