XCVC1802-2LSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 110,104.22 AED | Dhs. 110,104.22 AED |
| 15+ | Dhs. 106,627.23 AED | Dhs. 1,599,408.45 AED |
| 25+ | Dhs. 104,309.24 AED | Dhs. 2,607,731.00 AED |
| 50+ | Dhs. 98,514.29 AED | Dhs. 4,925,714.50 AED |
| 100+ | Dhs. 86,924.37 AED | Dhs. 8,692,437.00 AED |
| N+ | Dhs. 17,384.87 AED | Price Inquiry |
Couldn't load pickup availability
AMD Versal™ AI Core XCVC1802-2LSEVSVD1760 FPGA System-on-Chip
The AMD Versal AI Core XCVC1802-2LSEVSVD1760 represents cutting-edge adaptive computing technology, combining 1.5 million logic cells with powerful dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. This high-performance FPGA SoC is engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications requiring exceptional processing power and flexibility.
Key Features & Benefits:
- Massive Logic Capacity: 1.5M logic cells for complex FPGA fabric implementations
- Dual Processing Architecture: ARM Cortex-A72 MPCore (1.08GHz) + ARM Cortex-R5F (450MHz) with CoreSight debug
- Comprehensive Connectivity: Ethernet, PCIe, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial-Grade Reliability: 0°C to 100°C junction temperature operation
- High-Density Package: 1760-pin FCBGA (40mm x 40mm) for space-constrained designs
- 256KB On-Chip RAM: Fast local memory for real-time processing
Ideal Applications:
Perfect for advanced embedded systems, AI/ML edge inference, software-defined radio, industrial automation controllers, automotive ADAS, aerospace avionics, 5G/communications infrastructure, and high-performance data acquisition systems.
Authenticity Guaranteed: All AMD Versal AI Core devices are sourced directly from authorized distributors with full traceability and manufacturer warranty support. Each unit ships with proper anti-static packaging and handling documentation.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |

XCVC1802-2LSEVSVD1760.pdf