• XCVC1802-2MLEVSVA2197 AMD AMD IC SOC VERSAL AICORE FPGA 2197BGA Original Authentic IC Component
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AMD

XCVC1802-2MLEVSVA2197

Dhs. 114,339.34
Dhs. 120,357.18 Dhs. 114,339.34
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Recycling Electronic Components

AMD Versal™ AI Core XCVC1802-2MLEVSVA2197 FPGA

The AMD Versal AI Core XCVC1802-2MLEVSVA2197 is a high-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive computing with embedded processing, delivering exceptional performance and flexibility for next-generation intelligent systems.

Key Features

  • 1.5 Million Logic Cells – Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ – High-performance application processors running at 1.4GHz
  • Dual ARM® Cortex™-R5F – Real-time processors at 600MHz for deterministic control
  • 256KB On-Chip RAM – Fast embedded memory for critical operations
  • Advanced Connectivity – PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range – Operates reliably from 0°C to 100°C (TJ)
  • 2197-FCBGA Package – Compact 45x45mm form factor for space-constrained designs

Applications

Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, industrial automation, aerospace & defense, high-performance computing, and edge AI deployment.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

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