AMD XCVC1802-2MLEVSVD1760

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AMD Versal AI Core FPGA XCVC1802-2MLEVSVD1760

High-performance adaptive compute acceleration platform combining programmable logic with dual ARM Cortex-A72 MPCore and dual Cortex-R5F processors. Engineered for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.

Key Features

  • 1.5M Logic Cells – Extensive programmable fabric for complex HDL designs
  • Dual ARM Cortex-A72 MPCore with CoreSight – High-performance application processing at 1.4GHz
  • Dual ARM Cortex-R5F with CoreSight – Real-time control processing at 600MHz
  • 256KB On-Chip RAM – Fast embedded memory for critical operations
  • Advanced Connectivity – DDR, PCIe, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range – Reliable operation from 0°C to 100°C (TJ)
  • 1760-FCBGA Package – 40mm × 40mm footprint for high-density designs

Applications

Ideal for edge AI inference, software-defined networking, 5G wireless infrastructure, ADAS automotive systems, industrial automation, and mission-critical aerospace/defense platforms requiring deterministic real-time performance with FPGA flexibility.

Documentation & Support

Full technical documentation, reference designs, and Vivado Design Suite support available from AMD. RoHS compliant. Authentic AMD-sourced components with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)