XCVC1802-2MLIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 142,921.92 AED | Dhs. 142,921.92 AED |
| 15+ | Dhs. 138,408.61 AED | Dhs. 2,076,129.15 AED |
| 25+ | Dhs. 135,399.73 AED | Dhs. 3,384,993.25 AED |
| 50+ | Dhs. 127,877.52 AED | Dhs. 6,393,876.00 AED |
| 100+ | Dhs. 112,833.11 AED | Dhs. 11,283,311.00 AED |
| N+ | Dhs. 22,566.62 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1802-2MLIVSVA2197 FPGA System-on-Chip
The XCVC1802-2MLIVSVA2197 is a high-performance FPGA System-on-Chip from AMD's Versal™ AI Core series, engineered for demanding applications in industrial automation, automotive systems, aerospace, communications infrastructure, and edge computing deployments. This advanced SoC combines adaptive hardware acceleration with powerful ARM processing cores to deliver exceptional performance for AI/ML inference, real-time control, and high-speed data processing.
Key Features & Capabilities
- 1.5 Million Logic Cells – Massive programmable fabric for complex digital logic implementation and custom hardware acceleration
- Dual ARM® Cortex®-A72 MPCore™ – High-performance 64-bit application processors with CoreSight™ debug running at 1.4GHz for demanding computational workloads
- Dual ARM® Cortex™-R5F – Real-time processors with CoreSight™ for deterministic control tasks and safety-critical applications
- 256KB On-Chip RAM – Fast embedded memory for data buffering, processing, and low-latency operations
- Industrial Temperature Range – Operates reliably from -40°C to 100°C (junction temperature) for harsh environment deployments
- Rich Connectivity Options – PCIe, Ethernet, USB OTG, CANbus, I²C, SPI, UART, MMC/SD/SDIO interfaces for versatile system integration
- High-Speed Processing – 600MHz and 1.4GHz clock domains optimized for performance and power efficiency
- DDR Memory Support – High-bandwidth external memory interface with DMA for data-intensive applications
- 2197-FCBGA Package – Compact 45x45mm fine-pitch ball grid array for space-constrained designs
Target Applications
Ideal for advanced embedded systems requiring adaptive hardware acceleration, real-time processing, and AI/ML inference at the edge:
- Industrial Automation – Machine vision, robotics control, predictive maintenance, and smart manufacturing
- Automotive ADAS – Advanced driver assistance systems, sensor fusion, and autonomous driving platforms
- 5G Infrastructure – Baseband processing, network function virtualization, and edge computing nodes
- Aerospace & Defense – Avionics systems, radar processing, secure communications, and mission-critical computing
- Edge AI/ML – Real-time inference, computer vision, neural network acceleration, and intelligent edge devices
- High-Performance Computing – Data center acceleration, scientific computing, and computational workloads
Why Choose This FPGA SoC?
The XCVC1802-2MLIVSVA2197 delivers unmatched flexibility and performance for next-generation embedded systems. Its combination of adaptive FPGA fabric, powerful ARM processors, and comprehensive connectivity makes it the ideal choice for applications requiring hardware acceleration, real-time responsiveness, and AI/ML capabilities at the edge.
All specifications are sourced from official AMD documentation. This is an authentic, factory-new component with full manufacturer traceability and warranty support. Each device undergoes rigorous quality control and testing to ensure reliability in mission-critical applications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1802-2MLIVSVA2197.pdf