AMD XCVC1802-2MSEVSVA2197
Regular price
Dhs. 95,284.68
Regular price
Dhs. 100,299.64
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Dhs. 95,284.68
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 95,284.68 | Dhs. 95,284.68 |
| 15+ | Dhs. 92,275.67 | Dhs. 1,384,135.05 |
| 25+ | Dhs. 90,269.68 | Dhs. 2,256,742.00 |
| 50+ | Dhs. 85,254.69 | Dhs. 4,262,734.50 |
| 100+ | Dhs. 75,224.73 | Dhs. 7,522,473.00 |
| N+ | Dhs. 15,044.95 | Price Inquiry |
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AMD Versal™ AI Core XCVC1802-2MSEVSVA2197 FPGA
High-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced Versal AI Core device combines 1.5 million logic cells with dual ARM® Cortex®-A72 and Cortex®-R5F processors, delivering exceptional processing power and flexibility for complex embedded systems.
Key Features
- 1.5M Logic Cells – Extensive FPGA fabric for complex digital logic implementation
- Dual-Core Processing – ARM Cortex-A72 MPCore (1.4GHz) + ARM Cortex-R5F (600MHz) with CoreSight debug
- 256KB On-Chip RAM – Fast embedded memory for critical data processing
- Rich Connectivity – PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range – Reliable operation from 0°C to 100°C (junction temperature)
- Compact 2197-FCBGA Package – 45mm × 45mm flip-chip ball grid array for high-density designs
Ideal Applications
Perfect for high-performance embedded vision, AI inference at the edge, software-defined networking, 5G wireless infrastructure, advanced driver assistance systems (ADAS), aerospace avionics, and industrial automation requiring deterministic real-time control with FPGA acceleration.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
XCVC1802-2MSEVSVA2197.pdf
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