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XCVC1802-2MSEVSVD1760

Regular price Dhs. 91,747.77
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AMD Versal™ AI Core XCVC1802-2MSEVSVD1760 FPGA System-on-Chip

The XCVC1802-2MSEVSVD1760 is a high-performance FPGA SoC from AMD's Versal™ AI Core series, engineered for demanding industrial, automotive, aerospace, and edge computing applications. This advanced device combines 1.5 million logic cells with dual ARM® Cortex®-A72 and Cortex®-R5F processors, delivering exceptional processing power and flexibility for complex embedded systems.

Key Features & Benefits

  • Dual-core ARM® Cortex®-A72 MPCore™ running at 1.4GHz with CoreSight™ debug capabilities
  • Dual ARM® Cortex™-R5F real-time processors at 600MHz for deterministic control tasks
  • 1.5 million logic cells providing massive parallel processing capability
  • 256KB integrated RAM for high-speed data buffering
  • Comprehensive connectivity: PCIe, Gigabit Ethernet, USB OTG, CANbus, SPI, I²C, UART/USART
  • Industrial temperature range: 0°C to 100°C (junction temperature) for harsh environments
  • Compact 1760-FCBGA package (40mm × 40mm) optimizing board space

Ideal Applications

Perfect for high-bandwidth data processing, AI inference at the edge, advanced driver assistance systems (ADAS), aerospace avionics, 5G communications infrastructure, industrial automation, and vision processing systems requiring both FPGA fabric and embedded processing.

Why Choose This FPGA SoC?

The XCVC1802 combines the programmability of FPGA fabric with the software flexibility of ARM processors, enabling you to accelerate critical algorithms in hardware while running complex control software. With extensive I/O options including PCIe Gen4, 100G Ethernet capability, and DDR4 memory interfaces, this device provides the connectivity and bandwidth required for next-generation embedded systems.

Authentic AMD product | Full technical documentation available | Suitable for industrial and aerospace applications | Long product lifecycle support

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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