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XCVC1802-2MSIVSVD1760
Regular price
Dhs. 114,683.60
Regular price
Dhs. 120,719.56
Sale price
Dhs. 114,683.60
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 114,683.60 AED | Dhs. 114,683.60 AED |
| 15+ | Dhs. 111,062.00 AED | Dhs. 1,665,930.00 AED |
| 25+ | Dhs. 108,647.60 AED | Dhs. 2,716,190.00 AED |
| 50+ | Dhs. 102,611.63 AED | Dhs. 5,130,581.50 AED |
| 100+ | Dhs. 90,539.67 AED | Dhs. 9,053,967.00 AED |
| N+ | Dhs. 18,107.93 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1802-2MSIVSVD1760 FPGA
The XCVC1802-2MSIVSVD1760 is a high-performance System-on-Chip (SoC) FPGA from AMD's Versal™ AI Core series, designed for demanding applications in industrial automation, automotive systems, aerospace, communications infrastructure, and edge computing deployments.
Key Features
- 1.5 Million Logic Cells - Massive programmable fabric for complex digital designs
- Dual ARM® Cortex®-A72 MPCore™ processors running at 1.4GHz with CoreSight™ debug
- Dual ARM® Cortex™-R5F real-time processors at 600MHz with CoreSight™
- 256KB On-Chip RAM for high-speed data processing
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
- Rich Connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
- Advanced Peripherals: DDR memory controller, DMA, PCIe interface
Applications
Ideal for high-performance embedded systems requiring adaptive computing, AI acceleration, real-time processing, and extensive I/O connectivity. Perfect for industrial control systems, automotive ADAS, 5G infrastructure, aerospace avionics, and edge AI applications.
All specifications are subject to AMD's official datasheet. Contact us for availability, lead times, and volume pricing.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
XCVC1802-2MSIVSVD1760.pdf
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