AMD XCVC1902-1LLIVIVA1596

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AMD Versal™ AI Core XCVC1902-1LLIVIVA1596 FPGA

The AMD Versal AI Core XCVC1902-1LLIVIVA1596 is a high-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. Featuring 1.9 million logic cells and advanced processing capabilities, this device delivers exceptional computational power and flexibility for next-generation embedded systems.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ for high-performance application processing
  • Dual ARM® Cortex™-R5F with CoreSight™ for real-time control
  • 1.9M Logic Cells providing extensive programmable logic resources
  • 256KB RAM for on-chip memory requirements
  • Advanced Connectivity: PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environment deployment
  • High-Speed Processing: 400MHz and 1GHz operating frequencies
  • Compact 1596-FCBGA Package: 40x40mm footprint for space-constrained designs

Applications

Ideal for advanced embedded systems requiring adaptive intelligence, real-time processing, and high-bandwidth connectivity including 5G wireless infrastructure, automotive ADAS, aerospace avionics, industrial automation, and AI/ML edge computing platforms.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1596-BFBGA, FCBGA
Supplier Device Package 1596-FCBGA (40x40)