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XCVC1902-1LLIVSVD1760

Regular price Dhs. 146,810.07
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AMD Versal™ AI Core FPGA - XCVC1902-1LLIVSVD1760 | Professional-Grade System-on-Chip

Premium Industrial FPGA for Mission-Critical Applications - The AMD XCVC1902-1LLIVSVD1760 is a high-performance Versal™ AI Core FPGA System-on-Chip (SoC) engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. With 1.9 million logic cells and advanced heterogeneous processing capabilities, this device delivers exceptional computational power and flexibility for AI acceleration, real-time processing, and complex system integration.

Key Features & Technical Advantages

  • Massive Logic Capacity: 1.9M logic cells provide extensive resources for complex FPGA designs, parallel processing workloads, and scalable AI inference engines
  • Dual Processing Cores: Dual ARM® Cortex®-A72 MPCore™ (1GHz) and Dual ARM® Cortex™-R5F (400MHz) with CoreSight™ for heterogeneous computing and real-time control
  • Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C TJ) ensures reliable operation in harsh environments and mission-critical deployments
  • Rich Connectivity: Comprehensive peripheral support including PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, DDR4/LPDDR4, and multiple high-speed serial interfaces
  • Advanced Packaging: 1760-FCBGA (40x40mm) package optimized for high-density designs with excellent thermal performance and signal integrity
  • AI-Ready Architecture: Purpose-built for AI inference, machine learning acceleration, adaptive compute workloads, and neural network processing
  • Low Power Consumption: Advanced power management features enable efficient operation for battery-powered and thermally-constrained applications

Ideal Applications & Use Cases

  • AI/ML inference engines and edge AI processing platforms
  • Advanced driver-assistance systems (ADAS) and automotive computing modules
  • Aerospace and defense signal processing and radar systems
  • 5G/6G wireless infrastructure, baseband processing, and communications equipment
  • Industrial automation, robotics control, and factory automation systems
  • High-performance embedded vision systems and image processing
  • Medical imaging equipment and diagnostic systems
  • Network acceleration and data center infrastructure

Why Choose the XCVC1902-1LLIVSVD1760?

The XCVC1902-1LLIVSVD1760 represents AMD's cutting-edge Versal AI Core architecture, combining adaptive FPGA fabric with high-performance ARM processing cores and dedicated AI engines. This heterogeneous computing platform enables developers to partition workloads optimally between programmable logic, embedded processors, and AI accelerators, achieving superior performance-per-watt for AI-accelerated applications.

Development Ecosystem: Backed by AMD's comprehensive Vivado® Design Suite, Vitis™ unified software platform, and extensive documentation, this device shortens time-to-market while delivering production-grade reliability for mission-critical deployments. Full support for industry-standard tools and IP cores ensures seamless integration into existing design flows.

Quality & Authenticity Guaranteed: All AMD Versal devices are sourced directly from authorized distributors with full traceability, manufacturer warranty support, and compliance documentation. Each unit undergoes rigorous quality control and comes with certificate of conformance.

Technical Support & Documentation

Comprehensive technical resources available including datasheets, reference designs, application notes, and design guides. Our technical team provides expert support for schematic review, PCB layout guidance, and system integration assistance.

Order with Confidence: Fast worldwide shipping, secure packaging, ESD protection, and professional handling ensure your components arrive in perfect condition ready for integration.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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