AMD XCVC1902-1LSEVIVA1596

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AMD Versal™ AI Core XCVC1902-1LSEVIVA1596 FPGA

High-performance adaptive compute acceleration platform combining programmable logic with dual ARM® Cortex®-A72 and Cortex™-R5F processors. Engineered for AI inference, embedded vision, industrial automation, aerospace, and communications applications requiring 1.9 million logic cells and extensive connectivity.

Key Features

  • 1.9M Logic Cells – Versal™ AI Core FPGA architecture for complex HDL designs
  • Dual-Core Processing – ARM® Cortex®-A72 MPCore™ (1GHz) + Cortex™-R5F (400MHz) with CoreSight™ debug
  • 256KB On-Chip RAM – Low-latency memory for real-time processing
  • Rich Connectivity – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART, MMC/SD/SDIO
  • Industrial Temperature Range – 0°C to 100°C (TJ) for harsh environments
  • 1596-FCBGA Package – 40x40mm fine-pitch BGA for high-density designs

Applications

Ideal for AI/ML edge computing, 5G wireless infrastructure, automotive ADAS, industrial machine vision, avionics, and high-performance embedded systems requiring adaptive compute with deterministic real-time control.

All specifications preserved from official AMD documentation. RoHS compliant. Consult datasheet for complete electrical characteristics and design guidelines.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1596-BFBGA, FCBGA
Supplier Device Package 1596-FCBGA (40x40)