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XCVC1902-1LSEVSVA2197

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Recycling Electronic Components

AMD Versal™ AI Core XCVC1902-1LSEVSVA2197 FPGA

The AMD Versal AI Core XCVC1902-1LSEVSVA2197 is a high-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced FPGA combines adaptive computing with embedded processing power to deliver exceptional performance and flexibility.

Key Features

  • 1.9 Million Logic Cells - Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1GHz
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 400MHz
  • 256KB On-Chip RAM for high-speed data processing
  • Advanced Connectivity - PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
  • Compact 2197-FCBGA Package (45x45mm) for space-constrained designs

Applications

Ideal for high-performance embedded systems requiring adaptive computing, real-time processing, and extensive I/O connectivity. Perfect for industrial automation, automotive ADAS, aerospace avionics, 5G communications infrastructure, and AI/ML edge computing deployments.

Authenticity Guaranteed - All AMD Versal AI Core FPGAs are sourced directly from authorized distributors with full traceability and manufacturer warranty support.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

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