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XCVC1902-1LSIVSVD1760

Regular price Dhs. 122,342.46
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AMD Versal™ AI Core XCVC1902-1LSIVSVD1760 FPGA

The AMD Versal AI Core XCVC1902-1LSIVSVD1760 is a high-performance System-on-Chip (SoC) FPGA designed for demanding applications in industrial automation, automotive, aerospace, communications, and edge computing. This advanced device combines adaptive FPGA fabric with embedded processing subsystems to deliver exceptional performance and flexibility.

Key Features

  • 1.9 Million Logic Cells – Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ – High-performance application processing at 1GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ – Real-time processing at 400MHz for deterministic control
  • 256KB On-Chip RAM – Fast, low-latency memory for critical operations
  • Rich Connectivity – PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range – Qualified for -40°C to 100°C (TJ) operation
  • 1760-FCBGA Package – Compact 40x40mm footprint for space-constrained designs

Applications

Ideal for high-performance embedded systems requiring adaptive hardware acceleration, real-time processing, and extensive I/O connectivity including industrial control, automotive ADAS, 5G wireless infrastructure, aerospace avionics, edge AI inference, and video processing pipelines.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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