• XCVC1902-1MLIVSVA2197 AMD AMD IC SOC VERSAL AICORE FPGA 2197BGA Original Authentic IC Component
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AMD

XCVC1902-1MLIVSVA2197

Dhs. 127,036.75
Dhs. 133,722.87 Dhs. 127,036.75
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Recycling Electronic Components

AMD Versal AI Core FPGA XCVC1902-1MLIVSVA2197

High-performance System-on-Chip (SoC) FPGA combining adaptive computing with embedded processing for AI, automotive, aerospace, and industrial applications. Features dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors with 1.9 million logic cells for demanding edge computing and embedded system designs.

Key Features

  • 1.9M programmable logic cells for complex FPGA designs
  • Dual ARM Cortex-A72 MPCore (1.3GHz) + Dual ARM Cortex-R5F (600MHz) processors
  • 256KB integrated RAM with DDR, DMA, and PCIe peripherals
  • Comprehensive connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
  • Industrial temperature range: -40°C to 100°C (TJ)
  • 2197-FCBGA package (45x45mm) for high-density integration

Applications

Ideal for AI acceleration, automotive ADAS systems, aerospace avionics, industrial automation, edge computing, 5G infrastructure, and high-performance embedded systems requiring adaptive processing and real-time control.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

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