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XCVC1902-1MLIVSVD1760

Regular price Dhs. 122,334.80
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AMD Versal AI Core FPGA - XCVC1902-1MLIVSVD1760

The XCVC1902-1MLIVSVD1760 is a high-performance Versal AI Core FPGA from AMD, featuring 1.9 million logic cells and advanced heterogeneous processing capabilities. Designed for demanding applications in aerospace, automotive, communications, and industrial sectors, this device combines adaptive computing with embedded processing power.

Key Features

  • 1.9M Logic Cells - Massive programmable logic capacity for complex designs
  • Dual ARM Cortex-A72 MPCore with CoreSight at 1.3GHz - High-performance application processing
  • Dual ARM Cortex-R5F with CoreSight at 600MHz - Real-time processing and control
  • 256KB On-Chip RAM - Fast local memory for critical operations
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO
  • 1760-FCBGA Package (40x40mm) - Compact form factor with extensive I/O

Applications

Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, aerospace avionics, industrial automation, edge AI acceleration, and high-performance embedded computing platforms requiring adaptive hardware acceleration.

Documentation: Full datasheets and technical reference manuals available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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