AMD XCVC1902-1MSEVSVA2197

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AMD XCVC1902-1MSEVSVA2197 Versal AI Core FPGA

High-performance System-on-Chip (SoC) FPGA combining adaptive computing with embedded processing. The XCVC1902 features 1.9 million logic cells, dual ARM Cortex-A72 MPCore processors running at 1.3GHz, and dual ARM Cortex-R5F real-time processors at 600MHz for demanding industrial, automotive, aerospace, and communications applications.

Key Features

  • 1.9M Logic Cells – Extensive programmable logic resources for complex designs
  • Dual-Core Processing – ARM Cortex-A72 (1.3GHz) + ARM Cortex-R5F (600MHz) with CoreSight debug
  • 256KB On-Chip RAM – Fast embedded memory for data-intensive operations
  • Rich Connectivity – PCIe, Gigabit Ethernet, USB OTG, CANbus, SPI, I2C, UART
  • Industrial Temperature Range – Qualified for 0°C to 100°C junction temperature
  • 2197-FCBGA Package – 45mm × 45mm fine-pitch ball grid array for high I/O density

Applications

Ideal for edge AI inference, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, video processing, and high-performance embedded computing requiring adaptive hardware acceleration.

Documentation: Full datasheets, reference manuals, and development tools available from AMD. RoHS compliant. Authentic AMD product with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)