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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVC1902-1MSIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 105,866.90 AED | Dhs. 105,866.90 AED |
| 15+ | Dhs. 102,523.74 AED | Dhs. 1,537,856.10 AED |
| 25+ | Dhs. 100,294.97 AED | Dhs. 2,507,374.25 AED |
| 50+ | Dhs. 94,723.02 AED | Dhs. 4,736,151.00 AED |
| 100+ | Dhs. 83,579.14 AED | Dhs. 8,357,914.00 AED |
| N+ | Dhs. 16,715.83 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1902-1MSIVSVA2197 FPGA System-on-Chip
The AMD Versal AI Core XCVC1902-1MSIVSVA2197 is a high-performance FPGA System-on-Chip designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive computing with embedded processing, delivering exceptional performance and flexibility for next-generation system architectures.
Key Features
- 1.9 Million Logic Cells – Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore with CoreSight – High-performance 1.3GHz application processors
- Dual ARM Cortex-R5F with CoreSight – Real-time 600MHz processors for deterministic control
- 256KB On-Chip RAM – Fast embedded memory for data-intensive operations
- Advanced Connectivity – PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range – Qualified for -40°C to 100°C (TJ) operation
- 2197-FCBGA Package – 45x45mm fine-pitch ball grid array for high-density integration
Applications
Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, industrial automation and control, aerospace and defense systems, high-performance edge AI inference, video processing and transcoding, and software-defined networking appliances.
Authenticity Guaranteed – All AMD Versal devices are sourced from authorized distributors with full traceability and manufacturer warranty support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
XCVC1902-1MSIVSVA2197.pdf