AMD XCVC1902-2HSIVSVD1760

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AMD Versal™ AI Core XCVC1902-2HSIVSVD1760 FPGA

The AMD Versal AI Core XCVC1902-2HSIVSVD1760 is a high-performance System-on-Chip (SoC) FPGA designed for demanding applications in industrial automation, automotive, aerospace, communications, and edge computing. Featuring 1.9 million logic cells and a powerful heterogeneous processing architecture, this device delivers exceptional computational performance and flexibility.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ processors running at 1.65GHz with CoreSight™ debug
  • Dual ARM® Cortex™-R5F real-time processors at 800MHz with CoreSight™
  • 1.9M Logic Cells for extensive FPGA fabric resources
  • 256KB on-chip RAM for low-latency data processing
  • Industrial temperature range: -40°C to +100°C (TJ)
  • 1760-FCBGA (40x40mm) package for high-density integration

Connectivity & Peripherals

This Versal AI Core device offers comprehensive connectivity options including PCIe, Ethernet, USB OTG, CANbus, DDR, DMA, I2C, SPI, UART/USART, and MMC/SD/SDIO interfaces, making it ideal for complex system integration and multi-protocol communication requirements.

Applications

  • AI/ML inference and edge computing
  • 5G wireless infrastructure and communications
  • Automotive ADAS and autonomous driving systems
  • Aerospace and defense signal processing
  • Industrial automation and robotics
  • High-performance embedded vision systems

Why Choose AMD Versal AI Core?

The Versal AI Core family combines adaptive computing with AI engines, scalar processing, and high-speed connectivity in a single heterogeneous device. This XCVC1902 variant offers the perfect balance of processing power, FPGA fabric resources, and I/O flexibility for next-generation embedded systems requiring real-time performance, AI acceleration, and long-term reliability.

Authenticity Guaranteed: All AMD Versal devices are sourced directly from authorized distributors with full traceability and manufacturer warranty support.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)