• XCVC1902-2MLIVSVD1760 AMD AMD IC SOC VERSAL AICORE FPGA 1760BGA Original Authentic IC Component
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AMD

XCVC1902-2MLIVSVD1760

Dhs. 152,937.37
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Recycling Electronic Components

AMD Versal™ AI Core FPGA - XCVC1902-2MLIVSVD1760

High-performance System-on-Chip (SoC) FPGA combining adaptive logic with dual ARM® Cortex®-A72 and Cortex®-R5F processors. Engineered for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.

Key Features

  • 1.9 Million Logic Cells - Extensive programmable logic resources for complex designs
  • Dual-Core Processing - ARM Cortex-A72 MPCore (1.4GHz) + Cortex-R5F (600MHz) with CoreSight debug
  • 256KB On-Chip RAM - High-speed embedded memory
  • Industrial Temperature Range - Qualified for -40°C to +100°C (TJ) operation
  • Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I²C, UART, MMC/SD/SDIO
  • Compact 1760-FCBGA Package - 40mm × 40mm fine-pitch ball grid array

Applications

Ideal for edge AI inference, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, video processing, and high-speed data acquisition systems requiring deterministic real-time performance.

Documentation: Full datasheets, reference designs, and technical documentation available from AMD.

RoHS Compliance: Contact supplier for current compliance status and certifications.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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