AMD XCVC1902-2MLIVSVD1760
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Dhs. 152,932.37
Regular price
Dhs. 160,981.44
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Dhs. 152,932.37
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| 1 | Dhs. 152,932.37 | Dhs. 152,932.37 |
| 15+ | Dhs. 148,102.92 | Dhs. 2,221,543.80 |
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| 50+ | Dhs. 136,834.22 | Dhs. 6,841,711.00 |
| 100+ | Dhs. 120,736.08 | Dhs. 12,073,608.00 |
| N+ | Dhs. 24,147.22 | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1902-2MLIVSVD1760
High-performance System-on-Chip (SoC) FPGA combining adaptive logic with dual ARM® Cortex®-A72 and Cortex®-R5F processors. Engineered for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.
Key Features
- 1.9 Million Logic Cells - Extensive programmable logic resources for complex designs
- Dual-Core Processing - ARM Cortex-A72 MPCore (1.4GHz) + Cortex-R5F (600MHz) with CoreSight debug
- 256KB On-Chip RAM - High-speed embedded memory
- Industrial Temperature Range - Qualified for -40°C to +100°C (TJ) operation
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I²C, UART, MMC/SD/SDIO
- Compact 1760-FCBGA Package - 40mm × 40mm fine-pitch ball grid array
Applications
Ideal for edge AI inference, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, video processing, and high-speed data acquisition systems requiring deterministic real-time performance.
Documentation: Full datasheets, reference designs, and technical documentation available from AMD.
RoHS Compliance: Contact supplier for current compliance status and certifications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
XCVC1902-2MLIVSVD1760.pdf
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