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XCVC1902-2MSEVSVD1760

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AMD XCVC1902-2MSEVSVD1760 Versal™ AI Core FPGA – High-Performance Adaptive Computing Platform

The AMD XCVC1902-2MSEVSVD1760 is a cutting-edge Versal™ AI Core FPGA featuring 1.9 million logic cells, engineered for mission-critical applications in AI/ML acceleration, aerospace avionics, autonomous automotive systems, and industrial communications infrastructure. This advanced heterogeneous system-on-chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ debug and dual ARM® Cortex™-R5F real-time processors, delivering exceptional processing power at speeds up to 1.4GHz for compute-intensive workloads.

Key Features & Technical Advantages

  • Massive Logic Capacity: 1.9M logic cells enable complex FPGA designs, neural network acceleration, and adaptive hardware implementations
  • Heterogeneous Processing Architecture: Dual ARM Cortex-A72 MPCore (1.4GHz) for application processing + Dual Cortex-R5F (600MHz) for real-time control and safety-critical functions
  • 256KB On-Chip RAM: High-speed embedded memory optimized for data-intensive AI inference and signal processing operations
  • Comprehensive Connectivity: PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, DDR4/LPDDR4, Quad SPI, I2C, UART/USART, MMC/SD/SDIO interfaces for versatile system integration
  • Industrial Temperature Range: 0°C to 100°C (TJ) junction temperature rating for deployment in harsh environmental conditions
  • Space-Efficient Packaging: Compact 1760-pin FCBGA (Flip-Chip Ball Grid Array) in 40mm × 40mm footprint for high-density board designs
  • AI Engine Integration: Versal AI Core architecture with dedicated AI engines for machine learning inference acceleration
  • Adaptive Hardware Acceleration: Programmable logic fabric enables custom accelerators for domain-specific workloads

Target Applications & Use Cases

Ideal for AI inference at the edge, autonomous vehicle perception and sensor fusion, aerospace/defense avionics and radar systems, 5G/6G wireless infrastructure and beamforming, industrial automation and machine vision, high-performance embedded computing, software-defined radio (SDR), and applications requiring adaptive hardware acceleration with real-time processing capabilities.

Quality Assurance & Compliance

Authenticity Guaranteed: All AMD XCVC1902-2MSEVSVD1760 devices ship with complete manufacturer documentation, datasheets, and RoHS compliance certification. Backed by authorized distributor warranty, full traceability, and technical support for design-in assistance.

Design Resources & Documentation

Access comprehensive AMD Versal AI Core documentation, reference designs, development tools (Vivado Design Suite, Vitis AI), and technical application notes to accelerate your time-to-market. Contact our engineering team for design consultation and sample requests.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

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