XCVC1902-2MSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 101,956.77 AED | Dhs. 101,956.77 AED |
| 15+ | Dhs. 98,737.08 AED | Dhs. 1,481,056.20 AED |
| 25+ | Dhs. 96,590.62 AED | Dhs. 2,414,765.50 AED |
| 50+ | Dhs. 91,224.47 AED | Dhs. 4,561,223.50 AED |
| 100+ | Dhs. 80,492.18 AED | Dhs. 8,049,218.00 AED |
| N+ | Dhs. 16,098.44 AED | Price Inquiry |
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AMD XCVC1902-2MSEVSVD1760 Versal™ AI Core FPGA – High-Performance Adaptive Computing Platform
The AMD XCVC1902-2MSEVSVD1760 is a cutting-edge Versal™ AI Core FPGA featuring 1.9 million logic cells, engineered for mission-critical applications in AI/ML acceleration, aerospace avionics, autonomous automotive systems, and industrial communications infrastructure. This advanced heterogeneous system-on-chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ debug and dual ARM® Cortex™-R5F real-time processors, delivering exceptional processing power at speeds up to 1.4GHz for compute-intensive workloads.
Key Features & Technical Advantages
- Massive Logic Capacity: 1.9M logic cells enable complex FPGA designs, neural network acceleration, and adaptive hardware implementations
- Heterogeneous Processing Architecture: Dual ARM Cortex-A72 MPCore (1.4GHz) for application processing + Dual Cortex-R5F (600MHz) for real-time control and safety-critical functions
- 256KB On-Chip RAM: High-speed embedded memory optimized for data-intensive AI inference and signal processing operations
- Comprehensive Connectivity: PCIe Gen4, Gigabit Ethernet, USB OTG, CANbus, DDR4/LPDDR4, Quad SPI, I2C, UART/USART, MMC/SD/SDIO interfaces for versatile system integration
- Industrial Temperature Range: 0°C to 100°C (TJ) junction temperature rating for deployment in harsh environmental conditions
- Space-Efficient Packaging: Compact 1760-pin FCBGA (Flip-Chip Ball Grid Array) in 40mm × 40mm footprint for high-density board designs
- AI Engine Integration: Versal AI Core architecture with dedicated AI engines for machine learning inference acceleration
- Adaptive Hardware Acceleration: Programmable logic fabric enables custom accelerators for domain-specific workloads
Target Applications & Use Cases
Ideal for AI inference at the edge, autonomous vehicle perception and sensor fusion, aerospace/defense avionics and radar systems, 5G/6G wireless infrastructure and beamforming, industrial automation and machine vision, high-performance embedded computing, software-defined radio (SDR), and applications requiring adaptive hardware acceleration with real-time processing capabilities.
Quality Assurance & Compliance
Authenticity Guaranteed: All AMD XCVC1902-2MSEVSVD1760 devices ship with complete manufacturer documentation, datasheets, and RoHS compliance certification. Backed by authorized distributor warranty, full traceability, and technical support for design-in assistance.
Design Resources & Documentation
Access comprehensive AMD Versal AI Core documentation, reference designs, development tools (Vivado Design Suite, Vitis AI), and technical application notes to accelerate your time-to-market. Contact our engineering team for design consultation and sample requests.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |

XCVC1902-2MSEVSVD1760.pdf