XCVC1902-2MSIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 132,347.59 AED | Dhs. 132,347.59 AED |
| 15+ | Dhs. 128,168.19 AED | Dhs. 1,922,522.85 AED |
| 25+ | Dhs. 125,381.93 AED | Dhs. 3,134,548.25 AED |
| 50+ | Dhs. 118,416.26 AED | Dhs. 5,920,813.00 AED |
| 100+ | Dhs. 104,484.94 AED | Dhs. 10,448,494.00 AED |
| N+ | Dhs. 20,896.99 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1902-2MSIVSVA2197 FPGA System-on-Chip
The XCVC1902-2MSIVSVA2197 is a high-performance FPGA System-on-Chip from AMD's Versal™ AI Core series, engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines 1.9 million logic cells with powerful dual ARM® Cortex®-A72 and dual ARM® Cortex®-R5F processors, delivering exceptional processing capabilities for complex workloads.
Key Features & Benefits
- Massive Logic Capacity: 1.9M logic cells provide extensive programmable fabric for complex designs
- Dual Processing Architecture: ARM® Cortex®-A72 MPCore™ (1.4GHz) and Cortex™-R5F (600MHz) with CoreSight™ debug
- Industrial-Grade Reliability: Operating temperature range -40°C to 100°C (TJ) for harsh environments
- Rich Connectivity: PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- High-Speed Performance: Dual-core processing at 600MHz and 1.4GHz for real-time and compute-intensive tasks
- Compact Package: 2197-FCBGA (45x45mm) for space-constrained designs
Ideal Applications
Perfect for advanced embedded systems requiring adaptive computing, AI acceleration, high-bandwidth data processing, and real-time control in industrial automation, automotive ADAS, aerospace avionics, 5G infrastructure, and edge AI deployments.
Authentic AMD product with full traceability and quality assurance. Suitable for professional engineering and production environments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1902-2MSIVSVA2197.pdf