AMD XCVC1902-2MSIVSVD1760

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AMD Versal™ AI Core FPGA – XCVC1902-2MSIVSVD1760

High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. Ideal for aerospace, automotive, industrial automation, and communications applications requiring advanced AI/ML capabilities and real-time processing.

Key Features

  • 1.9M Logic Cells – Extensive programmable logic resources for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ (1.4GHz) + Dual ARM® Cortex™-R5F (600MHz) – High-performance heterogeneous processing
  • 256KB On-Chip RAM – Fast local memory for critical operations
  • Advanced Connectivity – PCIe, Ethernet, CANbus, USB OTG, DDR, SPI, I²C, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range – Qualified for -40°C to +100°C (TJ) operation
  • 1760-FCBGA Package (40×40mm) – High-density ball grid array for maximum I/O

Applications

Designed for mission-critical systems in aerospace & defense, automotive ADAS/autonomous driving, 5G wireless infrastructure, industrial machine vision, edge AI inference, and high-performance embedded computing.

Complete Specifications

Documentation: Full datasheets and technical reference manuals available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)