XCVC1902-2MSIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 127,428.20 AED | Dhs. 127,428.20 AED |
| 15+ | Dhs. 123,404.14 AED | Dhs. 1,851,062.10 AED |
| 25+ | Dhs. 120,721.44 AED | Dhs. 3,018,036.00 AED |
| 50+ | Dhs. 114,014.69 AED | Dhs. 5,700,734.50 AED |
| 100+ | Dhs. 100,601.20 AED | Dhs. 10,060,120.00 AED |
| N+ | Dhs. 20,120.24 AED | Price Inquiry |
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AMD Versal™ AI Core FPGA – XCVC1902-2MSIVSVD1760
High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. Ideal for aerospace, automotive, industrial automation, and communications applications requiring advanced AI/ML capabilities and real-time processing.
Key Features
- 1.9M Logic Cells – Extensive programmable logic resources for complex designs
- Dual ARM® Cortex®-A72 MPCore™ (1.4GHz) + Dual ARM® Cortex™-R5F (600MHz) – High-performance heterogeneous processing
- 256KB On-Chip RAM – Fast local memory for critical operations
- Advanced Connectivity – PCIe, Ethernet, CANbus, USB OTG, DDR, SPI, I²C, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range – Qualified for -40°C to +100°C (TJ) operation
- 1760-FCBGA Package (40×40mm) – High-density ball grid array for maximum I/O
Applications
Designed for mission-critical systems in aerospace & defense, automotive ADAS/autonomous driving, 5G wireless infrastructure, industrial machine vision, edge AI inference, and high-performance embedded computing.
Complete Specifications
Documentation: Full datasheets and technical reference manuals available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |

XCVC1902-2MSIVSVD1760.pdf