AMD XCVE1752-1LSENSVG1369
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Dhs. 64,694.65
Regular price
Dhs. 68,099.61
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Dhs. 64,694.65
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AMD Versal™ AI Core XCVE1752-1LSENSVG1369 FPGA
High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. The XCVE1752 delivers 1M logic cells in a compact 1369-FCBGA package, ideal for AI inference, embedded vision, and advanced driver assistance systems (ADAS).
Key Features
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1GHz for application processing
- Dual ARM® Cortex™-R5F with CoreSight™ at 400MHz for real-time control
- 1M Logic Cells for extensive programmable logic resources
- Industrial temperature range: 0°C to 100°C (TJ)
- Rich connectivity: PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART/USART
- Compact 35x35mm 1369-FCBGA package for space-constrained designs
Applications
Designed for demanding edge computing, industrial automation, automotive systems, aerospace/defense, 5G wireless infrastructure, and AI/ML acceleration workloads requiring deterministic real-time performance and adaptive hardware acceleration.
Documentation: Full datasheets and technical reference manuals available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
XCVE1752-1LSENSVG1369.pdf
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