AMD XCVE1752-1LSEVSVA2197

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AMD Versal™ AI Core XCVE1752-1LSEVSVA2197 - High-Performance FPGA SoC

The AMD XCVE1752-1LSEVSVA2197 is a cutting-edge Versal™ AI Core FPGA System-on-Chip designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive computing with embedded processing power to deliver exceptional performance and flexibility.

Key Features & Benefits

  • 1 Million Logic Cells - Massive programmable fabric for complex designs and high-density applications
  • Dual ARM® Cortex®-A72 MPCore™ - High-performance 1GHz application processors with CoreSight™ debug
  • Dual ARM® Cortex™-R5F - Real-time 400MHz processors for deterministic control with CoreSight™
  • Rich Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range - Reliable operation from 0°C to 100°C (junction temperature)
  • Advanced Package - 2197-pin FCBGA (45x45mm) for high I/O density and thermal performance

Ideal Applications

Perfect for aerospace & defense systems, industrial automation & control, automotive ADAS & infotainment, 5G wireless infrastructure, edge AI acceleration, high-speed networking equipment, medical imaging systems, and test & measurement instrumentation.

Backed by AMD's industry-leading quality and long-term product availability commitment. Comprehensive development tools and IP libraries available.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)