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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVE1752-1LSEVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 73,126.85 AED | Dhs. 73,126.85 AED |
| 15+ | Dhs. 70,817.59 AED | Dhs. 1,062,263.85 AED |
| 25+ | Dhs. 69,278.08 AED | Dhs. 1,731,952.00 AED |
| 50+ | Dhs. 65,429.29 AED | Dhs. 3,271,464.50 AED |
| 100+ | Dhs. 57,731.73 AED | Dhs. 5,773,173.00 AED |
| N+ | Dhs. 11,546.35 AED | Price Inquiry |
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AMD Versal™ AI Core XCVE1752-1LSEVSVA2197 - High-Performance FPGA SoC
The AMD XCVE1752-1LSEVSVA2197 is a cutting-edge Versal™ AI Core FPGA System-on-Chip designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive computing with embedded processing power to deliver exceptional performance and flexibility.
Key Features & Benefits
- 1 Million Logic Cells - Massive programmable fabric for complex designs and high-density applications
- Dual ARM® Cortex®-A72 MPCore™ - High-performance 1GHz application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5F - Real-time 400MHz processors for deterministic control with CoreSight™
- Rich Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range - Reliable operation from 0°C to 100°C (junction temperature)
- Advanced Package - 2197-pin FCBGA (45x45mm) for high I/O density and thermal performance
Ideal Applications
Perfect for aerospace & defense systems, industrial automation & control, automotive ADAS & infotainment, 5G wireless infrastructure, edge AI acceleration, high-speed networking equipment, medical imaging systems, and test & measurement instrumentation.
Backed by AMD's industry-leading quality and long-term product availability commitment. Comprehensive development tools and IP libraries available.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
XCVE1752-1LSEVSVA2197.pdf