AMD XCVE1752-1LSINSVG1369

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AMD Versal™ AI Core XCVE1752-1LSINSVG1369 - High-Performance FPGA SoC

The AMD Versal AI Core XCVE1752-1LSINSVG1369 represents cutting-edge FPGA technology, combining adaptive computing with embedded processing power. This advanced System-on-Chip delivers exceptional performance for AI acceleration, edge computing, communications infrastructure, and mission-critical aerospace applications.

Key Features & Benefits

  • Massive Logic Capacity: 1 million logic cells provide extensive programmable resources for complex designs
  • Dual Processing Cores: ARM Cortex-A72 MPCore (1GHz) and Cortex-R5F (400MHz) deliver robust embedded processing
  • Advanced Connectivity: Comprehensive I/O including PCIe, Ethernet, USB OTG, CANbus, and high-speed serial interfaces
  • Industrial-Grade Reliability: Extended temperature range (-40°C to 100°C TJ) for harsh environments
  • Flexible Integration: DDR memory interface, DMA, and multiple communication protocols

Ideal Applications

Perfect for demanding applications in industrial automation, 5G/6G wireless infrastructure, automotive ADAS systems, aerospace & defense, medical imaging, and AI/ML edge inference workloads.

Backed by AMD's industry-leading support and comprehensive development tools. Contact us for volume pricing, technical documentation, and application engineering assistance.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)