AMD XCVE1752-2LSENSVG1369

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AMD XCVE1752-2LSENSVG1369 Versal AI Core FPGA

High-performance adaptive compute acceleration platform featuring 1 million logic cells, dual ARM Cortex-A72 MPCore processors with CoreSight, and dual ARM Cortex-R5F processors. Engineered for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.

Key Features

  • Processing Power: Dual ARM Cortex-A72 MPCore (1.08GHz) + Dual ARM Cortex-R5F (450MHz) with CoreSight debug
  • Logic Capacity: 1 million logic cells for complex FPGA designs
  • Connectivity: PCIe, DDR, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Grade: Operating temperature 0°C to 100°C (TJ)
  • Package: 1369-FCBGA (35x35mm) for high-density integration

Applications

Ideal for edge AI inference, embedded vision systems, industrial automation controllers, automotive ADAS platforms, aerospace avionics, 5G wireless infrastructure, and high-performance embedded computing requiring heterogeneous processing with FPGA acceleration.

Documentation: Full datasheets, reference designs, and technical documentation available from AMD.

Compliance: RoHS compliant. Sourced from authorized distributors with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)