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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVM1302-1LLINSVF1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,804.35 AED | Dhs. 21,804.35 AED |
| 15+ | Dhs. 21,115.78 AED | Dhs. 316,736.70 AED |
| 25+ | Dhs. 20,656.75 AED | Dhs. 516,418.75 AED |
| 50+ | Dhs. 19,509.15 AED | Dhs. 975,457.50 AED |
| 100+ | Dhs. 17,213.96 AED | Dhs. 1,721,396.00 AED |
| N+ | Dhs. 3,442.79 AED | Price Inquiry |
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AMD Versal™ Prime XCVM1302-1LLINSVF1369 FPGA System-on-Chip
The AMD Versal Prime XCVM1302-1LLINSVF1369 is a high-performance FPGA System-on-Chip (SoC) designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive compute acceleration with embedded processing power, delivering exceptional performance and flexibility for next-generation system designs.
Key Features & Benefits
- Dual ARM Cortex-A72 MPCore™ processors running at 1GHz with CoreSight™ debug capabilities
- Dual ARM Cortex-R5F real-time processors at 400MHz for deterministic control tasks
- 70,000 logic cells of FPGA fabric for custom hardware acceleration
- Industrial-grade temperature range (-40°C to 100°C TJ) for harsh environments
- Rich connectivity options: CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- High-speed peripherals: DDR memory controller, DMA, PCIe for system integration
- Compact 1369-BFBGA package (35x35mm) optimizing board space
Ideal Applications
This Versal Prime SoC excels in applications requiring adaptive compute acceleration, real-time processing, and high-bandwidth connectivity including autonomous vehicles, industrial automation, 5G wireless infrastructure, aerospace avionics, medical imaging systems, and AI/ML edge inference platforms.
All products are sourced from authorized distributors and come with full traceability documentation. Contact us for volume pricing, lead times, and technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
XCVM1302-1LLINSVF1369.pdf