AMD XCVM1302-1LLIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 23,478.87 | Dhs. 23,478.87 |
| 15+ | Dhs. 22,737.41 | Dhs. 341,061.15 |
| 25+ | Dhs. 22,243.12 | Dhs. 556,078.00 |
| 50+ | Dhs. 21,007.39 | Dhs. 1,050,369.50 |
| 100+ | Dhs. 18,535.94 | Dhs. 1,853,594.00 |
| N+ | Dhs. 3,707.19 | Price Inquiry |
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AMD XCVM1302-1LLIVSVD1760 Versal™ Prime FPGA - High-Performance Adaptive Compute Acceleration Platform
The AMD XCVM1302-1LLIVSVD1760 represents the cutting edge of adaptive computing technology, combining FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. This Versal™ Prime series device delivers exceptional performance for aerospace, automotive, industrial automation, and telecommunications applications requiring long-term availability and RoHS compliance.
Why Choose the XCVM1302-1LLIVSVD1760?
Engineered for mission-critical systems demanding both processing power and adaptability, this Versal Prime FPGA combines heterogeneous compute engines with programmable logic to accelerate workloads that traditional processors cannot handle efficiently. Whether you're designing next-generation ADAS systems, 5G infrastructure, or aerospace flight control platforms, the XCVM1302 delivers the performance, reliability, and flexibility your application demands.
Key Features & Benefits
- Dual-Core Processing Power: Integrated ARM® Cortex®-A72 MPCore™ running at 1GHz plus dual ARM® Cortex™-R5F at 400MHz for real-time control and deterministic response
- 70,000 Logic Cells: Extensive FPGA resources for complex signal processing, custom acceleration, and algorithm implementation
- Industrial Temperature Range: Qualified for -40°C to 100°C (TJ) operation in harsh environments including automotive, aerospace, and outdoor industrial installations
- Comprehensive Connectivity: CANbus, Ethernet, PCIe Gen4, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces for seamless system integration
- Advanced Peripherals: DDR memory controller, DMA engines, PCIe for high-bandwidth data movement and system-level performance
- RoHS Compliant: Meets environmental standards for global deployment and regulatory compliance
- Compact 1760-FCBGA Package: 40mm x 40mm footprint optimized for space-constrained designs without compromising I/O density
- Long Lifecycle Support: AMD commitment to extended product availability for applications requiring multi-year supply assurance
Target Applications
Ideal for aerospace flight control systems, automotive ADAS and autonomous driving platforms, industrial robotics and machine vision, 5G wireless infrastructure and edge computing, medical imaging equipment, defense and secure communications systems requiring certified, traceable components with long lifecycle support and full manufacturer documentation.
Authorized Distribution & Full Traceability
Sourced exclusively from authorized AMD distributors with complete chain-of-custody documentation and manufacturer traceability. Every unit ships with comprehensive datasheets, reference designs, application notes, and compliance certificates to support your engineering validation, procurement qualification, and regulatory requirements. Avoid counterfeit risk—purchase only from authorized sources.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |

XCVM1302-1LLIVSVD1760.pdf