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XCVM1302-1LSENSVF1369
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Dhs. 14,534.74
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Dhs. 15,299.73
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Dhs. 14,534.74
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AMD Versal Prime XCVM1302-1LSENSVF1369 FPGA SoC
High-performance Versal Prime adaptive compute acceleration platform (ACAP) featuring dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors with CoreSight debug. Engineered for industrial, automotive, aerospace, and communications applications requiring robust processing power and extensive connectivity.
Key Features
- Dual-core ARM Cortex-A72 MPCore running at 1.3GHz with CoreSight debug
- Dual ARM Cortex-R5F real-time processors at 600MHz
- 70,000 logic cells for flexible FPGA fabric implementation
- 256KB integrated RAM for fast data access
- Advanced connectivity: PCIe, DDR, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART
- Industrial temperature range: 0°C to 100°C (TJ)
- Compact 1369-BGA package (35mm × 35mm) for space-constrained designs
Applications
Ideal for edge computing, embedded vision, motor control, industrial automation, automotive ADAS, aerospace avionics, and high-speed communications infrastructure.
Documentation: Full datasheets, reference designs, and technical documentation available from AMD.
Authenticity Guaranteed: Sourced from authorized distributors with full traceability and RoHS compliance.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
XCVM1302-1LSENSVF1369.pdf
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