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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVM1302-2HSINBVB1024
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,837.09 AED | Dhs. 21,837.09 AED |
| 15+ | Dhs. 21,147.49 AED | Dhs. 317,212.35 AED |
| 25+ | Dhs. 20,687.76 AED | Dhs. 517,194.00 AED |
| 50+ | Dhs. 19,538.44 AED | Dhs. 976,922.00 AED |
| 100+ | Dhs. 17,239.80 AED | Dhs. 1,723,980.00 AED |
| N+ | Dhs. 3,447.96 AED | Price Inquiry |
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AMD Versal™ Prime XCVM1302-2HSINBVB1024 FPGA
The AMD XCVM1302-2HSINBVB1024 is a high-performance Versal™ Prime series adaptive compute acceleration platform (ACAP) featuring 70,000 logic cells and advanced processing capabilities. This industrial-grade FPGA combines dual ARM® Cortex®-A72 MPCore™ processors with dual ARM® Cortex™-R5F cores, delivering exceptional computational power for demanding applications in automotive, aerospace, communications, and industrial automation.
Key Features
- 70k Logic Cells – Extensive programmable logic resources for complex designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1.4GHz
- Dual ARM® Cortex™-R5F with CoreSight™ running at 600MHz
- 256KB RAM – Integrated memory for efficient data processing
- Rich Connectivity – DDR, DMA, PCIe, CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Industrial Temperature Range – Operates reliably from -40°C to 100°C (TJ)
- 1024-BGA Package – Compact 31x31mm form factor
Applications
Ideal for advanced embedded systems requiring high-performance processing, real-time control, and extensive I/O connectivity including automotive ADAS, industrial automation controllers, aerospace avionics, 5G infrastructure, and edge computing platforms.
All specifications are sourced from official AMD documentation. Product ships in tray packaging with full RoHS compliance and manufacturer traceability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1024-BFBGA |
| Supplier Device Package | 1024-BGA (31x31) |
XCVM1302-2HSINBVB1024.pdf