AMD XCVM1302-2HSIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 24,457.52 | Dhs. 24,457.52 |
| 15+ | Dhs. 23,685.16 | Dhs. 355,277.40 |
| 25+ | Dhs. 23,170.27 | Dhs. 579,256.75 |
| 50+ | Dhs. 21,883.03 | Dhs. 1,094,151.50 |
| 100+ | Dhs. 19,308.56 | Dhs. 1,930,856.00 |
| N+ | Dhs. 3,861.71 | Price Inquiry |
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AMD Versal™ Prime XCVM1302-2HSIVSVD1760 FPGA
The XCVM1302-2HSIVSVD1760 is a high-performance Versal Prime adaptive compute acceleration platform (ACAP) from AMD, combining FPGA fabric with dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors. Engineered for aerospace, automotive, industrial automation, and telecommunications applications requiring long lifecycle support and RoHS compliance.
Key Features
- 70,000 Logic Cells - Scalable FPGA fabric for complex digital logic implementation
- Dual ARM Cortex-A72 MPCore with CoreSight - High-performance application processing at 1.65GHz
- Dual ARM Cortex-R5F with CoreSight - Real-time processing at 800MHz for deterministic control
- 1760-FCBGA Package (40x40mm) - Space-efficient BGA footprint for high-density designs
- Extended Temperature Range - Qualified for -40°C to 100°C (TJ) operation in harsh environments
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART/USART, MMC/SD/SDIO
- RoHS Compliant - Meets environmental and regulatory standards for global deployment
Applications
Ideal for embedded vision, motor control, industrial networking, avionics, ADAS, 5G infrastructure, edge AI acceleration, and mission-critical systems requiring traceable sourcing and manufacturer documentation.
Authorized Distribution
Sourced exclusively from authorized AMD distributors with full traceability, datasheets, and compliance certificates. Active part status ensures long-term availability for production and lifecycle management.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1302-2HSIVSVD1760.pdf