AMD XCVM1302-2LLENSVF1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,801.80 | Dhs. 21,801.80 |
| 15+ | Dhs. 21,113.31 | Dhs. 316,699.65 |
| 25+ | Dhs. 20,654.33 | Dhs. 516,358.25 |
| 50+ | Dhs. 19,506.86 | Dhs. 975,343.00 |
| 100+ | Dhs. 17,211.94 | Dhs. 1,721,194.00 |
| N+ | Dhs. 3,442.39 | Price Inquiry |
Request Quote / Inquiry
AMD Versal™ Prime XCVM1302-2LLENSVF1369 FPGA - High-Performance Adaptive Compute Acceleration Platform
The AMD XCVM1302-2LLENSVF1369 is a cutting-edge Versal™ Prime series adaptive compute acceleration platform (ACAP) combining FPGA fabric with embedded processing cores. This advanced semiconductor solution delivers exceptional performance for aerospace, automotive, industrial, medical, and telecommunications applications requiring high reliability and long lifecycle support.
Key Features & Benefits:
- Dual-Core Processing Power: Integrated dual ARM® Cortex®-A72 MPCore™ (1.08GHz) and dual ARM® Cortex™-R5F processors with CoreSight™ debug technology
- 70,000 Logic Cells: Extensive FPGA resources for complex digital logic implementation
- Comprehensive Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- High-Speed Peripherals: DDR memory controller, DMA, and PCIe support for demanding data transfer requirements
- Industrial Temperature Range: Operates reliably from 0°C to 100°C (junction temperature)
- RoHS Compliant: Meets environmental and regulatory standards for global deployment
- 1369-BGA Package: 35x35mm form factor optimized for high-density board designs
Backed by full traceability and AMD's long lifecycle commitment, this component is ideal for design-in applications requiring sustained availability and manufacturer support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| ROHS |

XCVM1302-2LLENSVF1369.pdf