AMD XCVM1302-2MLINBVB1024
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,837.39 | Dhs. 21,837.39 |
| 15+ | Dhs. 21,147.77 | Dhs. 317,216.55 |
| 25+ | Dhs. 20,688.04 | Dhs. 517,201.00 |
| 50+ | Dhs. 19,538.70 | Dhs. 976,935.00 |
| 100+ | Dhs. 17,240.03 | Dhs. 1,724,003.00 |
| N+ | Dhs. 3,448.01 | Price Inquiry |
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AMD Versal™ Prime XCVM1302-2MLINBVB1024 FPGA - High-Performance Adaptive Compute Acceleration Platform
The XCVM1302-2MLINBVB1024 is a cutting-edge Versal™ Prime FPGA from AMD, engineered for high-reliability applications in aerospace, automotive, industrial, medical, and telecommunications sectors. This adaptive compute acceleration platform combines FPGA fabric with dual ARM® processing cores to deliver exceptional performance and flexibility for your most demanding embedded system designs.
Key Features & Benefits
- Dual-Core Processing Power: Integrated ARM® Cortex®-A72 MPCore™ (1.4GHz) and dual ARM® Cortex™-R5F cores with CoreSight™ debug technology
- 70,000 Logic Cells: Extensive FPGA resources for complex digital logic implementation
- Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environment applications
- Rich Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
- High-Speed Peripherals: DDR memory controller, DMA, PCIe support for maximum throughput
- Compact 1024-BGA Package: 31x31mm footprint optimizes board space utilization
- RoHS Compliant: Meets environmental standards for global deployment
- Active Production Status: Long lifecycle commitment ensures design longevity
Ideal Applications
Perfect for design engineers working on advanced embedded systems requiring heterogeneous processing, real-time control, and high-speed data processing. Suitable for industrial automation, medical imaging, aerospace avionics, automotive ADAS, 5G infrastructure, and edge AI acceleration.
Why Choose This Component?
As an authorized AMD distributor, we provide 100% authentic components with full traceability, original manufacturer documentation, and compliance certification. Every unit ships with RoHS/REACH compliance documentation to support your design-in and regulatory requirements.
Packaging: Tray packaging for volume production and automated assembly processes.
All specifications are subject to manufacturer's datasheet. Contact us for lead times, volume pricing, and technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1024-BFBGA |
| Supplier Device Package | 1024-BGA (31x31) |
| ROHS |  |
XCVM1302-2MLINBVB1024.pdf