AMD XCVM1302-2MSENSVF1369

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AMD Versal™ Prime XCVM1302-2MSENSVF1369 FPGA

The AMD XCVM1302-2MSENSVF1369 is a high-performance Versal™ Prime Adaptive Compute Acceleration Platform (ACAP) combining FPGA fabric with embedded processing. This advanced SoC features dual ARM® Cortex®-A72 MPCore™ processors running at 1.4GHz and dual ARM® Cortex™-R5F real-time processors at 600MHz, delivering exceptional processing power for mission-critical applications.

Key Features:

  • 70,000 logic cells with MPU/FPGA hybrid architecture
  • Comprehensive connectivity: PCIe, DDR, Ethernet, CANbus, USB OTG, I2C, SPI, UART
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 1369-BGA package (35x35mm) in tray packaging
  • RoHS compliant for environmental compliance

Applications: Ideal for aerospace, automotive, industrial automation, telecommunications, medical devices, and high-reliability embedded systems requiring long lifecycle support and full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY