AMD XCVM1402-1LSINSVF1369

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AMD Versal™ Prime FPGA - XCVM1402-1LSINSVF1369

High-performance adaptive compute acceleration platform (ACAP) featuring dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors with CoreSight™ debug technology. Ideal for aerospace, automotive, industrial, medical, and telecommunications applications requiring long lifecycle support and full traceability.

Key Features

  • 1.2M Logic Cells - Versal™ Prime FPGA architecture for complex design implementation
  • Dual-Core Processing - ARM® Cortex®-A72 (1GHz) + ARM® Cortex™-R5F (400MHz) for versatile workload management
  • Advanced Connectivity - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - -40°C to 100°C (TJ) for harsh environment deployment
  • 1369-BGA Package - 35x35mm form factor for high-density board designs
  • RoHS Compliant - Meets environmental and regulatory standards

Authorized Distributor - Full manufacturer traceability, original documentation, and long lifecycle commitment for mission-critical applications.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY