AMD XCVM1402-1MSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,112.30 | Dhs. 21,112.30 |
| 15+ | Dhs. 20,445.57 | Dhs. 306,683.55 |
| 25+ | Dhs. 20,001.11 | Dhs. 500,027.75 |
| 50+ | Dhs. 18,889.93 | Dhs. 944,496.50 |
| 100+ | Dhs. 16,667.59 | Dhs. 1,666,759.00 |
| N+ | Dhs. 3,333.52 | Price Inquiry |
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AMD Versal Prime XCVM1402-1MSEVSVD1760 ACAP FPGA – Next-Generation Adaptive Computing Platform
The AMD Versal Prime XCVM1402 represents a breakthrough in adaptive computing, combining FPGA fabric with dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors in a single heterogeneous SoC architecture. Engineered for high-performance applications in aerospace, automotive, communications, and industrial systems, this ACAP (Adaptive Compute Acceleration Platform) delivers exceptional processing power and flexibility for mission-critical workloads.
Key Features & Benefits
- 1.2M Logic Cells – Extensive programmable logic resources for complex HDL designs, signal processing, and custom acceleration engines
- Dual-Core ARM Cortex-A72 @ 1.3GHz – High-performance 64-bit application processing with CoreSight debug and trace capabilities
- Dual-Core ARM Cortex-R5F @ 600MHz – Dedicated real-time control processors for safety-critical and deterministic workloads
- Rich Connectivity Portfolio – Integrated PCIe Gen4, multi-gigabit Ethernet, USB OTG, CANbus, DDR4/LPDDR4 controllers, SPI, I2C, UART, MMC/SD/SDIO interfaces
- 1760-FCBGA Package (40x40mm) – High-density fine-pitch BGA optimized for space-constrained embedded designs
- Industrial Temperature Range – 0°C to 100°C junction temperature (TJ) for reliable operation in harsh environments
- RoHS Compliant – Meets environmental and regulatory standards for global deployment
- Active Production Status – Long-term availability backed by AMD's commitment to embedded markets
Ideal Applications
Perfect for edge computing platforms, 5G wireless infrastructure, ADAS automotive systems, industrial automation and robotics, video processing and transcoding, AI/ML acceleration at the edge, software-defined radio, and mission-critical aerospace applications requiring deterministic performance, functional safety, and long-term supply availability.
Why Choose AMD Versal Prime XCVM1402?
This ACAP combines the flexibility of FPGA fabric with the software programmability of ARM processors, enabling you to accelerate compute-intensive workloads while running Linux, RTOS, or bare-metal applications. The heterogeneous architecture allows optimal workload partitioning between hardware acceleration and software processing, delivering superior performance-per-watt compared to traditional FPGA or processor-only solutions.
Documentation & Support
Technical Resources: Full datasheets, technical reference manuals, development tools, and application notes available from AMD. This device is backed by AMD's long-term supply commitment and supported by global authorized distribution channels ensuring authentic components with full traceability.
Ordering Information
Part Number: XCVM1402-1MSEVSVD1760
Package: 1760-FCBGA (40mm x 40mm)
Status: Active production
Compliance: RoHS compliant
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |

XCVM1402-1MSEVSVD1760.pdf