AMD XCVM1402-1MSIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 26,387.77 | Dhs. 26,387.77 |
| 15+ | Dhs. 25,554.47 | Dhs. 383,317.05 |
| 25+ | Dhs. 24,998.94 | Dhs. 624,973.50 |
| 50+ | Dhs. 23,610.11 | Dhs. 1,180,505.50 |
| 100+ | Dhs. 20,832.45 | Dhs. 2,083,245.00 |
| N+ | Dhs. 4,166.49 | Price Inquiry |
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AMD Versal™ Prime XCVM1402-1MSIVSVD1760 FPGA
The XCVM1402-1MSIVSVD1760 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ Prime series, featuring 1.2 million logic cells and advanced processing capabilities. This device combines FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors, delivering exceptional performance for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors.
Key Features:
- 1.2M Logic Cells - Extensive programmable logic resources for complex designs
- Dual-Core Processing - ARM Cortex-A72 MPCore (1.3GHz) + ARM Cortex-R5F (600MHz) with CoreSight debug
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- 1760-FCBGA Package - 40x40mm fine-pitch ball grid array for high-density integration
- RoHS Compliant - Meets environmental and regulatory standards
Applications:
Ideal for advanced embedded systems, edge computing, AI/ML acceleration, high-speed networking, signal processing, and mission-critical applications requiring long lifecycle support and full traceability.
Authorized Distributor - Full manufacturer traceability, original packaging, and long lifecycle commitment for design-in confidence.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1402-1MSIVSVD1760.pdf